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RO3035 Rogers PCB Board 10mil 0.254mm DK3.5 Immersion Gold For Patch Antenna

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RO3035 Rogers PCB Board 10mil 0.254mm DK3.5 Immersion Gold For Patch Antenna

Name: RO3035 Rogers PCB Board 10mil 0254mm DK35 Immersion Gold For Patch Antenna
Brand: Bicheng
Price: 1 USD

RO3035 Rogers PCB Board 10mil 0.254mm DK3.5 Immersion Gold For Patch Antenna Manufactures

Brand Name : Bicheng

Model Number : BIC-041.V1.0

Certification : UL, ISO9001, IATF16949

Place of Origin : CHINA

MOQ : 1PCS

Payment Terms : T/T

Supply Ability : 5000PCS per month

Delivery Time : 8-9 working days

Packaging Details : Vacuum bags+Cartons

Base material : RO3035

Layer count : 2 layers

PCB thickness : 0.3mm

PCB size : 55 x 57mm=1PCS

Copper weight : 0.5oz

Surface finish : immersion gold

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Rogers PCB Made on RO3035 10mil 0.254mm DK3.5 with Immersion Gold for Patch Antenna for Wireless Communications

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

Rogers RO3035 high frequency circuit materials are ceramic-filled PTFE composites intended for use in commercial microwave and RF applications. It was designed to offer exceptional electrical and mechanical stability at competitive prices. The mechanical properties are consistent. This allows the designer to develop multi-layer board designs without encountering warpages or reliability problems. RO3035 materials exhibit a coefficient of thermal expansion(CTE) in the X and Y axis of 17 ppm/℃. This expansion coefficient is matched to that of copper, which allows the material to exhibit excellent dimensional stability, with typical etch shrinkage, after etch and bake, of less than 0.5 mils per inch. The Z-axis CTE is 24 ppm/℃, which provides exceptional plated through-hole reliability, even in severe environments.

Typical applications:

1) Automotive radar

2) Datalink on cable systems

3) Global positioning satellite antennas

4) Power amplifiers and antennas

PCB Specifications

PCB SIZE	55 x 57mm=1PCS
BOARD TYPE	Double sided PCB
Number of Layers	2 layers
Surface Mount Components	YES
Through Hole Components	YES
LAYER STACKUP	copper ------- 18um(0.5 oz)+plate TOP layer
	RO3035 0.254mm
	copper ------- 18um(0.5 oz) + plate BOT Layer
TECHNOLOGY
Minimum Trace and Space:	4 mil / 4 mil
Minimum / Maximum Holes:	0.4 mm / 5.5 mm
Number of Different Holes:	5
Number of Drill Holes:	79
Number of Milled Slots:	0
Number of Internal Cutouts:	0
Impedance Control:	no
Number of Gold finger:	0
BOARD MATERIAL
Glass Epoxy:	RO3035 0.254mm
Final foil external:	1 oz
Final foil internal:	N/A
Final height of PCB:	0.3 mm ±0.1
PLATING AND COATING
Surface Finish	Immersion gold
Solder Mask Apply To:	N/A
Solder Mask Color:	N/A
Solder Mask Type:	N/A
CONTOUR/CUTTING	Routing
MARKING
Side of Component Legend	N/A
Colour of Component Legend	N/A
Manufacturer Name or Logo:	N/A
VIA	Plated through hole(PTH), minimum size 0.4mm.
FLAMIBILITY RATING	UL 94-V0 Approval MIN.
DIMENSION TOLERANCE
Outline dimension:	0.0059"
Board plating:	0.0029"
Drill tolerance:	0.002"
TEST	100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED	email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA	Worldwide, Globally.

Data Sheet of Rogers 3035 (RO3035)

RO3035 Typical Value
Property	RO3035	Direction	Units	Condition	Test Method
Dielectric Constant,εProcess	3.50±0.05	Z		10 GHz/23℃	IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign	3.6	Z		8GHz to 40 GHz	Differential Phase Length Method
Dissipation Factor,tanδ	0.0015	Z		10 GHz/23℃	IPC-TM-650 2.5.5.5
Thermal Coefficient of ε	-45	Z	ppm/℃	10 GHz -50℃to 150℃	IPC-TM-650 2.5.5.5
Dimensional Stability	0.11 0.11	X Y	mm/m	COND A	IPC-TM-650 2.2.4
Volume Resistivity	107		MΩ.cm	COND A	IPC 2.5.17.1
Surface Resistivity	107		MΩ	COND A	IPC 2.5.17.1
Tensile Modulus	1025 1006	X Y	MPa	23℃	ASTM D 638
Moisture Absorption	0.04		%	D48/50	IPC-TM-650 2.6.2.1
Specific Heat			j/g/k		Calculated
Thermal Conductivity	0.5		W/M/K	50℃	ASTM D 5470
Coefficient of Thermal Expansion (-55 to 288℃)	17 17 24	X Y Z	ppm/℃	23℃/50% RH	IPC-TM-650 2.4.4.1
Td	500		℃ TGA		ASTM D 3850
Density	2.1		gm/cm³	23℃	ASTM D 792
Copper Peel Stength	10.2		Ib/in.	1oz,EDC After Solder Float	IPC-TM 2.4.8
Flammability	V-0				UL 94
Lead-free Process Compatible	Yes

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RO3035 Rogers PCB Board 10mil 0.254mm DK3.5 Immersion Gold For Patch Antenna

RO3035 Rogers PCB Board 10mil 0.254mm DK3.5 Immersion Gold For Patch Antenna

RO3035 Rogers PCB Board

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0.254mm Rogers PCB Board

RO3035 Rogers PCB Board 10mil 0.254mm DK3.5 Immersion Gold For Patch Antenna Images