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0.8mm TLX-9 PCB With Hot Air Soldering Level For Passive Components

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0.8mm TLX-9 PCB With Hot Air Soldering Level For Passive Components

Brand Name : Bicheng

Certification : UL, ISO9001, IATF16949

Place of Origin : CHINA

MOQ : 1PCS

Price : USD9.99-99.99/PCS

Payment Terms : T/T

Supply Ability : 5000PCS per month

Delivery Time : 8-9 working days

Packaging Details : Vacuum bags+Cartons

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Today, we will be discussing the TLX-9 PCB, which is a type of woven glass reinforced PTFE PCB.

The TLX-9 PCB utilizes combinations of 1080 or 106 style fiberglass and demonstrates exceptional dimensional and electrical performance. Furthermore, it is available in various thicknesses, which makes it well-suited for double-sided or multilayer applications.

Let's now delve into the detailed data sheet.

Typical Properties of TLX-9

TLX-9 possesses a low dielectric constant of 2.5 at 10 GHz, along with a low dissipation factor of 0.0019 at the same frequency. These characteristics make it an excellent choice for high-frequency applications where maintaining signal integrity is crucial.

In addition to its impressive electrical properties, TLX-9 also exhibits a moisture absorption rate of less than 0.02%, ensuring stability and reliability even in damp environments.

With a dielectric breakdown voltage exceeding 60 kV, TLX-9 is suitable for use in high-voltage applications.

Both the volume resistivity and surface resistivity of TLX-9 surpass 10^7 Mohm/cm, ensuring excellent electrical insulation properties.

TLX-9 also demonstrates an arc resistance of over 180 seconds, indicating exceptional resistance to electrical arcing.

Property Value Units Test Method
Dielectric Constant @ 10 GHz 2.5 IPC-TM 650 2.5.5.5
Dissipation Factor @ 10 GHz 0.0019 IPC-TM 650 2.5.5.5
Moisture Absorption <0.02 % IPC-TM 650 2.6.2.1
Dielectric Breakdown >60 kV IPC-TM 650 2.5.6
Volume Resistivity 10^7 Mohm/cm IPC-TM 650 2.5.17.1
Surface Resistivity 10^7 Mohm IPC-TM 650 2.5.17.1
Arc Resistance >180 seconds IPC-TM 650 2.5.1
Flexural Strength Lengthwise >23,000 (>159) lbs./in. (N/mm2) IPC-TM 650 2.4.4
Flexural Strength Crosswise >19,000 (>131) lbs./in. (N/mm2) IPC-TM 650 2.4.4
Peel Strength (1oz copper) 12 lbs./linear in. IPC-TM 650 2.4.8
Thermal Conductivity 0.19 W/m/K ASTM F 433
X-Y CTE 9-12 ppm/°C ASTM D 3386 (TMA)
Z CTE 130- 145 ppm/°C ASTM D 3386 (TMA)
UL-94 Flammability Rating V-0 UL-94

In terms of mechanical strength, TLX-9 delivers outstanding performance. It exhibits a flexural strength of over 23,000 lbs./in. in the lengthwise direction and over 19,000 lbs./in. in the crosswise direction, making it an extremely durable material.

Additionally, TLX-9 has a peel strength of 12 lbs./linear in. for 1 oz. copper.

However, the thermal conductivity of TLX-9 is only 0.19 W/m/K.

It has a coefficient of thermal expansion (CTE) of 9 ppm/°C in the X-direction and 12 ppm/°C in the Y-direction, while in the Z-direction, it ranges from 130-145 ppm/°C.

Finally, TLX-9 possesses a UL-94 flammability rating of V-0, indicating its high resistance to ignition and its ability to quickly self-extinguish in the event of a fire.

Outgassing Properties

TLX-9 boasts a long-standing history in space and can withstand severe environments such as radiation resistance. The results of the outgassing test show that TLX-9 has a total mass loss (TML) of 0.02%. The collected volatile condensable materials (CVCM) amount to 0.01%, while the water vapor regained (WVR) is zero. These extremely low levels far exceed the required standards.

Property Test Method Units Value
Outgassing (%TML) ASTM E 595 24 H 257 °F @ ≤ 5 x 10-5 Torr 0.02
Outgassing (%CVCM) ASTM E 595 24 H 257 °F @ ≤ 5 x 10-5 Torr 0.01
Outgassing (%WVR) ASTM E 595 24 H 257 °F @ ≤ 5 x 10-5 Torr 0.00

PCB Capability (TLX-9)

TLX-9 PCBs are available in single-sided, double-sided, multi-layer, and hybrid configurations.

TLX-9 PCBs come in a wide range of thicknesses. Conventional options include 10 mils, 20 mils, 31 mils, and 60 mils, among others. They can be as thin as 2 mils and as thick as 250 mils, catering to the needs of our designers.

The finished copper on track lines can be 1oz or 2oz.

The maximum PCB size for TLX-9 is 400mm by 500mm. It can be a single board within the sheet or accommodate different designs within a panel.

We offer solder masks in various colors such as green, black, blue, red, and yellow.

For pad surface finishes, we provide options including immersion gold, HASL, immersion silver, immersion tin, bare copper, OSP, pure gold, and ENEPIG.

PCB material: PTFE based Fibreglass Laminates
Designation: TLX-9
Dielectric constant: 2.5
Layer count: Sinlge-sided PCB, Double-sided PCB, Multi-layer PCB, Hybrid PCB
Dielectric thickness: 2mil(0.051mm), 10mil (0.254mm), 20mil (0.508mm), 25mil (0.635mm), 31mil(0.787mm), 50mil (1.27mm), 60mil (1.524mm), 75mil(1.905mm), 90mil (2.286mm), 100mil (2.54mm), 125mil (3.175mm), 150mil (3.81mm), 200mil (5.08mm), 250mil (6.35mm)
Copper weight: 1oz (35µm), 2oz (70µm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Red, Yellow etc.
Surface finish: Immersion gold, HASL, Immersion silver, Immersion tin,Bare copper, OSP, Pure gold, ENEPIG etc..

TLX-9 finds applications in radar systems, mobile communications, microwave test equipment, and microwave transmission devices, among others. The TLX product lines are highly regarded in the RF microwave substrates industry due to the mechanical support provided by the fiberglass, ensuring resistance to harsh environments. This includes resistance to creep for PCBs attached to housings experiencing high vibration levels during space launch, protection against high temperatures in engine modules, radiation resistance in space, resilience in harsh marine environments for warship antennas, and the ability to withstand a broad temperature range during flight, among other applications.

0.8mm TLX-9 PCB With Hot Air Soldering Level For Passive Components


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