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HDI PCB 10-Layer High TG FR4 1.6mm with Blind Vias RF Circuit Boards

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HDI PCB 10-Layer High TG FR4 1.6mm with Blind Vias RF Circuit Boards

Brand Name : Bicheng

Certification : UL, ISO9001, IATF16949

Place of Origin : CHINA

MOQ : 1PCS

Price : USD9.99-99.99/PCS

Payment Terms : T/T

Supply Ability : 5000PCS per month

Delivery Time : 8-9 working days

Packaging Details : Vacuum bags+Cartons

Material : FR-4 IT-180 CORE; IT-180 PP Prepreg

Layer count : 10-layer

PCB size : 269mm x 213mm=1 PCS

PCB thickness : 1.6mm +/- 10%

Surface finish : ENIG

Solder Mask : Both sides, Green

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Our newly shipped 10-layer N+4+N HDI PCB is engineered for high-reliability, high-speed, and high-power applications, making it ideal for automotive, networking, telecommunications, and server systems. Built with ITEQ IT-180A FR-4 material, this PCB offers exceptional thermal stability, CAF resistance, and signal integrity, ensuring robust performance in demanding environments.

Key Specifications:
Layers: 10 (N+4+N HDI structure)

Material: ITEQ IT-180A FR-4 (High Tg 175°C, CAF-resistant)

Board Thickness: 1.6mm ±10%

Board Size: 269mm x 213mm (1-piece panel)

Surface Finish: Electroless Nickel Immersion Gold (ENIG)

Solder Mask: Green (both sides)

Silkscreen: White (both sides)

Advanced Stack-Up & Construction:

Blind Vias: L1-L2, L7-L10

Buried Vias: L2-L8

Via Filling: Type VII (filled & capped)

Min. Hole Size: 0.2mm

Min. Trace Width/Spacing: 110µm

Min. Dielectric Thickness: 100µm

Copper Weight: 1/2 oz (18µm) base + plating (up to 45µm on outer layers)

HDI PCB 10-Layer High TG FR4 1.6mm with Blind Vias RF Circuit Boards

High-Performance IT-180A Material Benefits

With high thermal reliability, it withstands extended exposure to elevated temperatures, achieving T288 >20 minutes and T266 >60 minutes, ensuring stability during lead-free reflow and harsh operating conditions.

The material's low coefficient of thermal expansion (CTE)—11-15 ppm/°C in the X/Y axes—minimizes warpage and enhances dimensional stability, critical for multilayer PCBs in high-temperature environments.

For high-speed designs, IT-180A provides excellent signal integrity, featuring a dielectric constant (Dk) of 4.4 and dissipation factor (Df) of 0.015 at 10GHz, reducing signal loss and maintaining consistent performance in RF and high-frequency applications.

Additionally, the material offers superior anti-CAF (conductive anodic filament) resistance, preventing electrical failures and ensuring high through-hole reliability in humid or high-voltage conditions.

Compliant with modern environmental standards, IT-180A is lead-free and UL 94 V0 flame-retardant, meeting stringent safety requirements for automotive, industrial, and telecommunications applications.

Quality & Compliance:
The Gerber RS-274-X artwork ensures precise manufacturing, while IPC Class 2 standards guarantee consistent quality.

Global Availability
Available worldwide, this 10-layer HDI PCB is ideal for:

Automotive ECUs (engine control units)

Data center servers & networking hardware

Telecom base stations & RF modules

Industrial power electronics

This high-reliability 10-layer HDI PCB ensures superior thermal management, signal integrity, and durability, making it the perfect choice for mission-critical electronics.

HDI PCB 10-Layer High TG FR4 1.6mm with Blind Vias RF Circuit Boards


Product Tags:

10 Layer HDI PCB

      

1.6mm HDI PCB

      

Blind Vias HDI PCB

      
 HDI PCB 10-Layer High TG FR4 1.6mm with Blind Vias RF Circuit Boards Manufactures

HDI PCB 10-Layer High TG FR4 1.6mm with Blind Vias RF Circuit Boards Images

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