This 4-layer rigid PCB uses aerospace-grade F4BTM450 material to deliver superior electrical, thermal, and mechanical performance for high-frequency, mission-critical systems. Meeting IPC-Class-2 standards, it provides a high-reliability solution for aerospace, microwave, and military applications and serves as a competitive alternative to premium imported options.
PCB Specification
| Parameter | Specification |
| Base Material | F4BTMS450 (advanced PTFE-nano-ceramic composite) |
| Layer Configuration | 4-layer rigid PCB |
| Board Dimensions | 20mm x 20mm per unit (tolerance: ±0.15mm) |
| Finished Board Thickness | 1.4mm |
| Copper Weight (Finished) | 1oz (1.4 mils / 35μm) |
| Via Plating Thickness | 20μm |
| Minimum Trace/Space | 4 mils / 5 mils |
| Minimum Hole Size | 0.3mm |
| Vias | 4 total (no blind vias) |
| Surface Finish | Immersion Gold |
| Silkscreen | Top: No; Bottom: No |
| Solder Mask | Top: No; Bottom: No |
| Quality Assurance | 100% Electrical test prior to shipment |
Precise PCB Stack-up
-Copper Layer 1: 35μm (1oz)
-F4BTMS450 Core: 0.127mm (5mil)
-Copper Layer 2: 35μm (1oz)
-Prepreg RO4450F: 0.102mm (4mil)
-F4BTMS450 Core: 0.127mm (5mil)
-Copper Layer 3: 35μm (1oz)
-Prepreg RO4450F: 0.102mm (4mil)
-F4BTMS450 Core: 0.762mm (30mil)
-Copper Layer 4: 35μm (1oz)
F4BTMS450 Material Advantages
F4BTMS450 is an upgraded iteration of the F4BTM series, featuring a breakthrough formulation of polytetrafluoroethylene (PTFE) resin, ultra-thin/ultra-fine glass fiber cloth, and uniformly distributed special nano-ceramics. Key benefits include:
-Minimized electromagnetic wave propagation interference from glass fibers, reducing dielectric loss.
-Enhanced dimensional stability and reduced X/Y/Z anisotropy, ensuring consistency across extreme conditions.
-Extended usable frequency range, improved electrical strength, and superior thermal conductivity.
-Low thermal expansion coefficient and stable dielectric temperature characteristics.
-Standard RTF (Reverse Treat Foil) low-roughness copper foil, reducing conductor loss and delivering excellent peel strength (compatible with copper or aluminum bases).
F4BTMS450 Key Electrical & Mechanical Properties
| Property | Specification |
| Dielectric Constant (Dk) | 4.5 ±0.09 (10GHz) |
| Dissipation Factor (Df) | 0.0015 (10GHz); 0.0019 (20GHz) |
| Coefficient of Thermal Expansion (CTE) | X-axis: 12 ppm/°C; Y-axis: 12 ppm/°C; Z-axis: 45 ppm/°C (-55°C to 288°C) |
| Thermal Coefficient of Dk | -58 ppm/°C (-55°C to 150°C) |
| Flame Rating | UL-94 V0 |
| Thermal Conductivity | 0.64 W/MK |
| Moisture Absorption | 0.08% (max) |
Typical Applications
This PCB is ideal for demanding environments and high-performance systems, including:
-Aerospace equipment, space vehicles, and cabin systems
-Microwave and RF (Radio Frequency) devices
-Military radar and general radar systems
-Feed networks for high-frequency applications
-Phase-sensitive antennas and phased array antennas
-Satellite communications systems
-Other mission-critical electronics requiring stable performance under extreme temperatures and conditions.
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RF/Microwave F4BTMS450 PCB 4-Layer 1.4mm Thick Images
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